週次 |
日期 |
單元主題 |
第1週 |
9/09 |
Welcome to EDA Seminar! |
第2週 |
9/16 |
Prof. Tsung-Yi Ho, National Tsing Hua Univ.
The Coming of Age of Microfluidics: EDA Solutions for Enabling Biochemistry on a Chip (投影片僅供自用) |
第3週 |
9/23 |
Yoyo Li, Mentor Graphics
EDA Multi-patterning Physical Verification Solutions beyond 16nm Nodes (投影片僅供自用) |
第4週 |
9/30 |
(颱風假暫停)陳威利副處長 & 江庭瑋經理, TSMC
台積電先進製程翻轉你對未來的想像--你所不知道的「前瞻佈局」 |
第5週 |
10/07 |
頂尖國際會議論文報告 Part I: EMSOFT-2019 (ESWEEK)
Graph-based modeling, scheduling, and verification for intersection management of intelligent vehicles
|
第6週 |
10/14 |
Dr. Jason Ho, VIA Labs 威鋒電子
Designs for Hardware Security in USB Links and PDs |
第7週 |
10/21 |
頂尖國際會議論文報告 Part II: ICCAD-2019
Obstacle-aware group-based length-matching routing for pre-assignment area-I/O flip-chip designs |
第8週 |
10/28 |
李价剛特助, 南亞科技
智慧製造技術 (不可拍照及錄音錄影) |
第9週 |
11/04 |
No class for midterm week |
第10週 |
11/11 |
Woei-Tzy Wells Jong, Group Director, Cadence
ECO Introduction and Cadence Full Automatic Solution (投影片僅供自用) |
第11週 |
11/18 |
Dr. Yuan-Hao Chang, Academia Sinica
System Design and Optimization for Embedded Deep Learning (投影片僅供自用) |
第12週 |
11/25 |
蔡旻修處長, 創意電子Global Unichip Corp.
可測試性設計(DFT)的機會與挑戰 |
第13週 |
12/02 |
頂尖國際會議論文報告 Part III:
DAC-19: A DAG-based algorithm for obstacle-aware topology-matching on-track bus routing
CVPR-19: PMS-Net: Robust Haze Removal Based on Patch Map for Single Images |
第14週 |
12/09 |
Prof. Shao-Yun Fang, NTUST
Pin access optimization using machine learning |
第15週 |
12/16 |
John Wang, Senior Manager, Synopsys
Scaling challenges and TCAD solution for semiconductor technology |
第16週 |
12/23 |
陳東傑博士, 執行長, 至達科技MaxEDA
頂尖EDA國際會議經驗分享 |
第17週 |
12/30 |
頂尖國際會議論文報告 Part IV:
IEDM-19: Optimal Design Methods to Transform 3D NAND Flash into a High-Density, High-Bandwith and Low-Power Nonvolatile Computing in Memory (NVCIM) Accelerator for Deep-Learning Neural Networks (DNN) |